Cooling of Miniature Electronic Systems Using Diamond Circuit Boards

Abstract

The drive for miniaturization of electronic systems has led to increases in spatial power density of electronic devices, making thermal management a critical challenge. For applications which require placing electronic components into increasingly smaller areas, such as 3D IC system-in-package architectures, greater thermal loads increase the probability of device failure. In this work, we present a circuit board consisting of polycrystalline diamond which has excellent thermal conductivity and electrical resistivity. Moreover, water cooling channels are integrated into the circuit board to achieve rapid and spatially-uniform cooling compared with an alumina ceramic circuit board. The total ..